DIRECTLY COPPER BONDED SUBSTRATE

摘要

PURPOSE: To provide a direct copper bonded substrate which eliminates warp caused by a temperature cycle with maintaining strength. CONSTITUTION: In the direct copper bonded substrate, which has copper layers respectively on both main surfaces of an electric insulating substrate. On one layer, patterns are formed gap apart from each other, and on another layer, cross section in the back side region of gaps is reduced to decrease tensile force which is generated on copper cross sections corresponding to the gaps. This suppress temperature cycle from generating force which distorts the substrate.