| 摘要 |
PURPOSE:To enable the bump electrode of a semiconductor device to be directly connected to the film wiring of a flexible film by a method wherein a step is provided to a board possessed of a board wiring, a flexible film possessed of a film wiring is bonded to the step, and a semiconductor device is provided spreading over the flexible film and the board. CONSTITUTION:A film wiring 22 is provided onto the upside of a flexible film 21. A flexible film 21 is so mounted on the tread of a step 15 provided to a board 12 as to make the upside of film wiring 22 flush with that of a board wiring 23. Bump electrodes 13 serving as input/output terminals are provided to the semiconductor device 11. The semiconductor device 11 is provided stretching over the board 11 and the film wiring 22. A connection between the semiconductor device 11 and both the film wiring 22 and the board wiring 23 is made by bringing the bump electrodes 13 into contact with both the film wiring 22 and the board wiring 23 respectively. An intsulating resin 24 is interposed between the semiconductor device 11 and both the board 12 and the flexible film 21. |
