| 摘要 |
PURPOSE:To reduce the number of individual parts and enable automatic assembling by integrally molding a terminal assembling body including each terminal with an externally armored resin case and by assembling the padding part connecting terminal and conductor pattern of insulating substrate with the solder junction. CONSTITUTION:A package combining an externally armored resin case 10 to a metal base plate 1, semiconductor elements 4, 5 mounted on the metal base 1 via an insulating substrate 2, a main circuit terminal 6 and auxiliary terminal 7 for external connection and an internal connecting terminal 16 are provided. A terminal assembling body 15 including each terminal is arranged at the internal side of an external armored resin case 10 to integrally mold with the case 10. Moreover, the soldering part 16a of the internal connecting terminal 16 is soldered to a conductor pattern of the insulating substrate 2 for the assembling. Thereby, each terminal can be fixed and held with good accuracy to the predetermined position in the case 10 at a time simultaneously with formation of the external armored resin case 10. Moreover, the assembling process can be simplified and automatically done. |
