发明名称 EQUIPMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE:To connect a conductive member to the electrode of a semiconductor pellet keeping the pellet heated. CONSTITUTION:A support block 3 which supports a semiconductor pellet 1, a heating means 4 which heats the semiconductor pellet 1, a measuring means 14 which measures the surface temperature distribution of the pellet 1 located on the support block 3, a connecting means 5 which electrically connects the electrode of the pellet 1 with a conductive member 2, and a connection starting position determining means 15 which determines the connection starting position of the conductive member 6 by the connecting means 5 on the basis of the temperature distribution data outputted from the measuring means 14 are provided. By this setup, even if a semiconductor pellet 1 varies in surface temperature, the electrode of the semiconductor pellet 1 can be surely connected to the conductive member 6, so that a semiconductor device of high reliability can be manufactured.
申请公布号 JPH07321161(A) 申请公布日期 1995.12.08
申请号 JP19940106453 申请日期 1994.05.20
申请人 NEC KANSAI LTD 发明人 YOSHIKAWA YOSHIFUMI
分类号 H01L21/60;H01L21/603 主分类号 H01L21/60
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