| 摘要 |
PURPOSE:To provide a polishing device which can accurately polish the surface of a semiconductor substrate to a flat surface and bonding method by which semiconductor substrates can be excellently bonded to each other. CONSTITUTION:In a semiconductor polishing device, a suction force supplied from a suction port 35 is transmitted to semiconductor substrate 31 through a porous interior part 33 and porous elastic pad 32 and the substrate 31 is attracted to one surface of the pad 32. A bonding device, on the other hand, attaches a reinforcing member having prescribed rigidity to one of the substrates to be bonded and controls the warping of the substrates at the bonding time by utilizing the rigidity of the reinforcing member. |
