发明名称 PROCESSING DEVICE
摘要 <p>PURPOSE:To improve response of temperature control of a processing object of a processing device wherein a chuck is used. CONSTITUTION:Since a heat source means and a heat exchanger are provided inside a heat transmission gas supply course 18 for supplying transmission gas to a fine space formed between a chuck means 12 and a processing object W, heat transmission efficiency of a heat transmission course leading to a processing object from a mounting stand can be improved and in-plane temperature distribution of a processing object can be made uniform.</p>
申请公布号 JPH07321184(A) 申请公布日期 1995.12.08
申请号 JP19940136510 申请日期 1994.05.25
申请人 TOKYO ELECTRON LTD 发明人 NISHIKAWA HIROSHI
分类号 H01L21/302;H01L21/3065;H01L21/68;H01L21/683;(IPC1-7):H01L21/68;H01L21/306 主分类号 H01L21/302
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