| 摘要 |
PURPOSE:To prevent increase of an installation area of a processing device due to a large aperture of a substrate by executing a series of processes while keeping a normal of a substrate surface approximately horizontal and by holding a substrate in a process by electrostatic attraction force using electrostatic force. CONSTITUTION:A substrate 1 is carried to a substrate processing chamber 5 while being kept vertical by a substrate holding device 6 wherein electrostatic attraction force is used and is processed on a single-wafer basis. Since a foot print of a substrate processing device and a carrier system can be miniaturized and hardly changeable even an aperture of the substrate 1 is made large, the same device whose occupation area of a clean room is small can be used. Furthermore, since an electrostatic attraction method is used for holding a substrate, the device 6 does not need to be brought into contact with a substrate surface and a foreign matter hardly attaches. |
