发明名称 APPARATUS FOR SENSING PRESSURE IN MOLD CAVITY DURING INJECTION OF MOLDED PARTS
摘要 <p>An apparatus (10) for approximating the mold cavity pressure during injection of a liquid material by measuring the pressure exerted by the liquid against an ejector assembly. The ejector assembly includes an ejector sleeve (20) and a support. A load sensor (50) is positioned between a load and support to measure the pressure. In a first embodiment, the sensor is omitted and strain gauges (50a-d) are mounted on a force translation fixture (30) to measure the elastic deformation of the fixture and approximate mold cavity pressure. In a second embodiment, the strain gauges are mounted on a reduced diameter portion (74) of an ejector sleeve (20'). In a third embodiment, the base of the ejector sleeve is separated into two lobes (80a-b) connected to one another by two bending beams (82a-b). In a fourth embodiment, strain gauges are applied to a core pin (14) to approximate pressure in the mold cavity.</p>
申请公布号 WO9532855(A1) 申请公布日期 1995.12.07
申请号 WO1995US06759 申请日期 1995.05.30
申请人 RJG TECHNOLOGIES, INC. 发明人 WATKINS, BRAD, H.
分类号 B29C45/77;G01L9/00;(IPC1-7):B29C45/40 主分类号 B29C45/77
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