摘要 |
The invention relates to a method or continuous uniform electrolytic metallising or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductive films in installations through which the material for treatment passes horizontally. In order to avoid metal coatings of differing thicknesses being deposited on narrow and wide conductor strips in printed circuit boards, according to the present invention operation is with movable, preferably rotating roller-haped intermediate electrodes, which roll without short circuit at a very close effective distance above the material for treatment, or which contact the said material in a wiping manner. These intermediate electrodes are not electrically connected to the source of bath current and are located between the surface of the material for treatment and a suitable counter- electrode.
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