发明名称 Solventless or high solids-containing silicone pressure sensitive adhesive compositions.
摘要 <p>Solventless and high solids-containing silicone pressure sensitive adhesive compositions having high peel adhesion and high tack are provided, comprising (A) a toluene-soluble resinous copolymer containing R3SiO1/2 units and SiO4/2 units; (B) a vinyl-terminated polydiorganosiloxane; (C) a hydrogen-terminated polydiorganosiloxane; (D) a hydrosilation catalyst; and (E) from 0 to about 10 percent by weight of an organic solvent; provided that the combined viscosity of (B) and (C) is from about 10 to about 500 centipoises at 25 DEG C., the combined crosslink densities of (B) and (C) is from about 0.3 to about 5.0 %, preferably 0.3 to about 2.0%, and the molar ratio of silicon-bonded hydrogen groups in (C) to silicon-bonded alkenyl groups in (B) is in the range of from about 0.8:1 to about 1.5:1 and preferably about 1:1.</p>
申请公布号 EP0506372(B1) 申请公布日期 1995.12.06
申请号 EP19920302584 申请日期 1992.03.25
申请人 GENERAL ELECTRIC COMPANY 发明人 WENGROVIUS, JEFFREY HAYWARD;VAN VALKENBURGH, VIRGINIA MARY;BURNELL, TIMOTHY BRYDON
分类号 C09J183/00;C09J183/04;C09J183/07;(IPC1-7):C09J183/07 主分类号 C09J183/00
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