发明名称 |
Polishing agent used for polishing silicon wafers and polishing method using the same. |
摘要 |
<p>A polishing agent used for polishing a silicon wafer is composed of a colloidal silica polishing agent containing an ethyl silicate monomer and/or an ethyl silicate polymer. Even when the polishing agent is used with a rigid polishing pad, it is able to provide a polished wafer having an excellent flatness and whose surface has a roughness comparable to that obtained by the conventional final polishing process. <IMAGE></p> |
申请公布号 |
EP0685877(A2) |
申请公布日期 |
1995.12.06 |
申请号 |
EP19950108481 |
申请日期 |
1995.06.01 |
申请人 |
SHIN-ETSU HANDOTAI COMPANY LIMITED |
发明人 |
MASUMURA, HISASHI, HARANAKA COMPANY FLAT 106;SUZUKI, KIYOSHI |
分类号 |
B24B37/00;B24B37/04;C09G1/02;C09K3/14;H01L21/304;H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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