| 摘要 |
Procedure for manufacturing power modules with semiconductor elements. Of the type that enables the integration of several individual components 14 into a single module, and whose purpose is to reduce both the number of manufacturing process phases and the diversity of materials to be used, allowing greater and easier automation of production, and reducing its cost. It consists of: a first phase of stamping one or two sheets, creating base 11 and terminal 16 sheets, in such a way that some bases 11 that in the end must be separated, are initially kept joined by sections 13 making the assembly rigid; a second phase of welding the different elements 14 onto the corresponding bases 11 and terminals 16; a third phase of connecting up the bases 11, elements 4 and terminals 16 that make up the means of connection with the outside; a fourth phase of encapsulation 20 of the assembly by providing insulation between the separate components 14 and with the outside; a fifth phase of separation of the bases 11 that have to form the module, isolating those that were kept joined in the first phase by means of the sections 13 for giving rigidity; for obtaining one or more power modules at once. <IMAGE>
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