Integrated circuit interconnect system for wafer test

摘要

The Interconnect system between two circuit sections (8, 11) arranged on a carrier body, linking contact points (10, 12), where the interconnect contact is by a contactor element (1), is characterised as follows: - The contactor element is formed as a flexible lead carrier (2), with a flat perimeter area (13). - The lead carrier (2) has a middle region between the perimeter area and a raised spring-loaded section (4). - The lead carrier has a malleable contact region (5) on leads contacting the first circuit section (10). - The lead carrier (2) at its boundary (13) has contact points (6) to contact the contact points (1) of the second circuit section.