ELECTRONIC DEVICE PACKAGE AND ITS MANUFACTURE

摘要

A highly reliable thin electronic device package such that the electronic device encapsulated in the package does not tilt nor be exposed from the package. In the electronic device package manufacturing method, spacers are placed between the inner surface of the mold and lead wires connected to the electronic device, and a material is injected into a mold. Therefore, a highly reliable electronic device package is manufactured with a high yield.