The measurement and/or control of the height (40) of a soldering wave produced by means of a solder pump (16) is claimed. Solder is directed into a branch element (32) which reaches at least up to the height (40), and is located between the pump and an opening (31) of an outlet (28) from the solder bath (12). Above the branch element there are means (36) which detect the solder level (41) and deliver a signal to a processing unit (38).
