Method for manufacturing bump leaded film carrier type semiconductor device.

摘要

An insulating film (3) has conductive layers (6) on a first surface (S1) and conductive protrusions (9) on a second surface (S2). The conductive layers (6) are connected to the conductive protrusions (9) via through holes provided in the insulating film. A semiconductor chip (1) having pads (2) is adhered by an adhesive layer (22) to the insulating film (3). Then, the conductive layers (6) are locally pressured, so that the conductive layers (6) are electrically connected to respective ones of the pads (2).