| 摘要 |
<p>PURPOSE:To improve the mounting reliability of the method and device for mounting a semiconductor chip with its face downward using a thermosetting adhesive. CONSTITUTION:An adhesive 3 is applied to the semiconductor chip mounting part of a substrate 1, the adhesive 3 is pre-heated by the local heating of the substrate 1, a semiconductor chip 4 which is heated to the thermosetting temperature of the adhesive 3 is pressed to the semiconductor chip mounting part of the substrate 1, and then the adhesive 3 is cured. A semiconductor chip suction means is provided on the lower surface of a pressure head 6 for heating the semiconductor chip 4 to the thermosetting temperature of the adhesive 3, a heating body 11 is lowered from the head 6 by a vertically movable means 12, and the heating body 1 contacts the substrate 1 before the semiconductor chip 4 contacts the adhesive 3.</p> |
