| 摘要 |
PURPOSE: To form a very thin package of electrically and thermally high quality for single and multisemiconductor devices, by combining various electronic packaging techniques by a unique method. CONSTITUTION: A thin mechanically stable substrate, i.e., packaging material 12 is selected, and has high thermal conductivity. One or more semiconductor devices are accommodated in a recess 14 in the substrate, i.e., the packaging material 12, and directly fixed to the substrate, i.e., the packaging material. A lead frame, i.e., a flex circuit 20 is arranged on the substrate, i.e., the packaging material, adjacently to the semiconductor devices. One or more semiconductor devices are mutually connected with leads on the lead frame, i.e., the flex circuit, by a multilayered thin film overlay 18. |
