| 摘要 |
<p>PCT No. PCT/EP94/00750 Sec. 371 Date Sep. 14, 1995 Sec. 102(e) Date Sep. 14, 1995 PCT Filed Mar. 10, 1994 PCT Pub. No. WO94/21706 PCT Pub. Date Sep. 29, 1994Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per molecule and (B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, and an aromatic polyamine as the hardener.</p> |
