发明名称 |
Semiconductor device processing method |
摘要 |
A semiconductor processing method includes the steps of carrying a case containing semiconductor wafers and to which an ID card is attached into semiconductor processing equipment at a first side of the semiconductor processing equipment; removing the ID card from the case; taking the semiconductor wafers out of the case; carrying the semiconductor wafers taken out of the case into a processing means on a second side, opposite to the first side, of the semiconductor processing equipment; processing the semiconductor wafers in the processing means; attaching the ID card corresponding to the semiconductor wafers to the case; taking the processed semiconductor wafers out of the processing means at the first side of the semiconductor processing equipment; putting the processed semiconductor wafers into the case to which the ID card is attached; and carrying the case outside the semiconductor equipment at the first side of the semiconductor equipment.
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申请公布号 |
US5470392(A) |
申请公布日期 |
1995.11.28 |
申请号 |
US19940340350 |
申请日期 |
1994.11.14 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YAMADA, YOSHIAKI;IWASAKI, JUNJI;OHMORI, MASASHI |
分类号 |
H01L21/02;H01L21/00;H01L21/304;H01L21/677;(IPC1-7):G03D5/04 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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