发明名称 PATTERN FORMING MATERIAL
摘要 PURPOSE:To obtain a pattern forming material capable of arbitrary controlling an mol.wt., satisfactory even to UV and far UV, minimizing the reduction of the intensity of light, not causing the unstabilization of the degree of vacuum in a vacuum process during the production of a wafer, the contamination of a process atmosphere or the deceleration of dissolution of a polymer, eliminating the unstableness of patterning and suitable for a pattern forming material used in the production of super-LSI, etc. CONSTITUTION:This pattern forming material is based on a narrow-dispersed polymer represented by the formula and having a mol.wt. distribution (wt. average mol.wt./number average mol.wt,.) of 1.0-1.4. In the formula, R is H or methyl, each of (m) and (n) is a positive number and m+n=1.
申请公布号 JPH07311464(A) 申请公布日期 1995.11.28
申请号 JP19940125678 申请日期 1994.05.16
申请人 SHIN ETSU CHEM CO LTD 发明人 YAMADA MOTOYUKI;FURUHATA TOMOYOSHI
分类号 G03F7/039;G03F7/004;G03F7/033;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/039
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