发明名称 |
Process for producing a circuit substrate |
摘要 |
A process for producing circuit substrate is prepared by preparing at least one ceramic greensheet containing glass and sinterable at a low temperature for forming the circuit substrate, and at least one unsintered transfer sheet unsinterable at a sintering temperature of the ceramic greensheet, printing a wiring pattern on the unsintered transfer sheet, stacking the unsintered transfer sheet on the ceramic greensheet to form a laminated body and thermocompressing the laminated body to form a compressed body, firing the compressed body at a sintering temperature of the ceramic greensheet to form a ceramic substrate, thereby preparing a fired body by transferring the wiring pattern on the unsintered transfer sheet to the ceramic substrate, and removing the unsintered transfer sheet from the fired body to prepare a circuit substrate.
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申请公布号 |
US5470412(A) |
申请公布日期 |
1995.11.28 |
申请号 |
US19930097120 |
申请日期 |
1993.07.27 |
申请人 |
SUMITOMO METAL CERAMICS INC. |
发明人 |
FUKUTA, JUNZO;FUKAYA, MASASHI;ARAKI, HIDEAKI |
分类号 |
H01L21/48;H05K1/03;H05K1/09;H05K3/20;H05K3/46;(IPC1-7):B32B31/04;B32B31/20;B32B31/26;C04B33/32 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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