| 摘要 |
PURPOSE:To improve heat dissipation and cope with multi-pin and narrow pitch, by forming electrodes which are composed of a conductive thin film part and independent of inner leads, as the relay electrodes for a semiconductor chip and the inner leads, via an insulating layer isolated on a metal plane. CONSTITUTION:A metal plane 8 is fixed in a state that is overlaps with inner leads 3 via an insulating layer 7. Conductive thin film parts 16 to serve as the relay electrodes for the inner leads 3 and a semiconductor chip are formed, via an electrodeposition adhesive insulating layer 15 isolated on the metal plane 8. Thereby a lead frame of high reliability can be obtained which is excellent in heat dissipation and electric characteristic, can cope with narrow pitch, and has no fear of ion migration in an electrode part. |
