发明名称 TRANSFER MOLDING DEVICE
摘要 PURPOSE:To provide a transfer molding device which is capable of holding scrap within the device and is capable of reducing exchange frequency of scrap boxes. CONSTITUTION:A resin sealing part 10 resin-seals a work 12. A scrap removal part 20 removes scrap such as a runner of a molded product stuck to the resin- sealed work 12 from the work 12. A scrap holding part 44 is provided on the lower part of the scrap removal part 20 and holds the scrap which is removed from the work 12 and fell in the holding part 44. A scrap processing part pulverizes the scrap falling into a space between the scrap removal part 20 and scrap holding part 44.
申请公布号 JPH07308933(A) 申请公布日期 1995.11.28
申请号 JP19940102430 申请日期 1994.05.17
申请人 APIC YAMADA KK 发明人 HIUGA NORIYUKI
分类号 B29C45/02;B29K105/26;(IPC1-7):B29C45/02 主分类号 B29C45/02
代理机构 代理人
主权项
地址