| 摘要 |
PURPOSE:To contrive to improve the bending resistance of the bent part of a multilayer flexible circuit board by a method wherein a nonjoint is provided in the bent part of the circuit board so as to prevent the flexible insulating base material on one side of flexible insulating base materials in the bent part from jointing with a wiring conductor through the surface on one side of its surfaces or with the other flexible insulating base material. CONSTITUTION:The flexible circuit board on one side of flexible circuit boards is formed by a method wherein a wiring conductor 2 with a necessary wiring pattern formed of a conductor foil is formed on the surface on one side of the surfaces of a flexible insulating base material 1 via A pepper bonding agent layer 3 and a surface protective layer 4 using an insulating film is applied on the surface of the conductor 2 via a bonding agent layer 5. The other flexible circuit board is formed by a method wherein a wiring conductor 7 is formed on the upper surface of a flexible insulating base material 6 via a bonding agent layer 8 and a surface protective layer 9 is applied on the surface of the conductor 7 via a bonding agent layer 10. A non-joint 12 is formed between bent sites of these two flexible circuit boards and joints 11 are formed between the flexible circuit boards excluding the bent parts of the circuit boards. Accordingly, the bending resistance of the bent parts can be improved. |
