| 摘要 |
PURPOSE:To eliminate fluctuation in the cite bonding strength and wire bonding strength and to protect a substrate against cracking at the time of die bonding by improving the die bonding of a gas sensor substrate. CONSTITUTION:A glass layer 12 and a gold paste layer 10 are laminated on the rear side of an alumina substrate 2 and parallel gap welded to the gold plating layer 14 of a frame 4. At the time of parallel gap welding, the gold paste layer 10 is thermally welded to the gold plating layer 14 to provide a uniform die bonding strength. Furthermore, the die bonding material is not scattered to the sensor body 16 side and thereby a uniform wire bonding strength is obtained. The glass layer 12 prevents heat shock from being transferred to the substrate 2 at the time of die bonding thus protecting the substrate against cracking. |
