Acoustic temperature and film thickness monitor and method
摘要
An acoustic temperature and/or film thickness monitoring system for semiconductor wafers in which the velocity of acoustic waves in the wafer is employed to measure temperature and/or thickness.
申请公布号
US5469742(A)
申请公布日期
1995.11.28
申请号
US19930028331
申请日期
1993.03.09
申请人
LEE, YONG J.;KHURI-YAKUB, BUTRUS T.;SARASWAT, KRISHNA C.
发明人
LEE, YONG J.;KHURI-YAKUB, BUTRUS T.;SARASWAT, KRISHNA C.
