发明名称 CHEMICAL AND MECHANICAL POLISHING APPARATUS
摘要 PURPOSE:To prevent mutual contamination between treatments by a method wherein a conveyance means is provided with a plurality of clamps which are used selectively according to the contamination degree of a substrate to be treated. CONSTITUTION:A head part 22 is installed at the free end of a conveyanc means 21, and three each of claws 23A, 23B, 23C as clamps which can sink into, and rise from, the rear surface of the head part 22 are installed at the peripheral edge part. The claws are arranged so as to be deviated by an angle of about 120 deg. each from the center of the head part 22, and three groups of one each of the claws 23A, 23B, 23C are arranged. Then, the claws 23A, 23B, 23C rise and sink selectively by a rising and sinking drive means. The operation of the claws is set in such a way that the claws 23A are used when a wafer 1 is conveyed to a polishing plate from, e.g. a loader-side stage, that the claws 23B are used when the polished wafer 1 on the polishing plate is conveyed to a rough removal plate and that the claws 23C are used when the roughly removed wafer 1 is conveyed to an unloader-side stage.
申请公布号 JPH07312356(A) 申请公布日期 1995.11.28
申请号 JP19940101437 申请日期 1994.05.17
申请人 SONY CORP 发明人 SATO JUNICHI
分类号 B24B41/06;H01L21/304;H01L21/306;H01L21/677;H01L21/68 主分类号 B24B41/06
代理机构 代理人
主权项
地址