| 发明名称 |
A METHOD OF TREATING A SEMI-CONDUCTOR WAFER |
| 摘要 |
A method of treating a semi-conductor wafer is described in which a short-chain polymer is deposited on the wafer to planarise surface features on the wafer and a diffusion layer is deposited on the surface of the polymer layer to allow moisture to be released from the polymer at a controlled rate.
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| 申请公布号 |
CA2167085(A1) |
申请公布日期 |
1995.11.23 |
| 申请号 |
CA19952167085 |
申请日期 |
1995.05.10 |
| 申请人 |
ELECTROTECH EQUIPMENTS LIMITED |
发明人 |
DOBSON, CHRISTOPHER DAVID;KIERMASZ, ADRIAN |
| 分类号 |
H01L21/312;H01L21/316;(IPC1-7):H01L21/316;H01L21/314 |
主分类号 |
H01L21/312 |
| 代理机构 |
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