| 发明名称 |
FUSIONNWELDING METHOD FOR SEMICONDUCTOR CHIP |
| 摘要 |
PURPOSE:To improve thermal conductivity with mechanical strength improved by forming a coating of a metal or semiconductor for forming an eutectic alloy together with a substance and semiconductor chip and by making them into an eutectic alloy by heating. |
| 申请公布号 |
JPS5432972(A) |
申请公布日期 |
1979.03.10 |
| 申请号 |
JP19770099280 |
申请日期 |
1977.08.19 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L21/52;H01L21/58;H01S5/00 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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