SOLDER DEPOSITING COMPOSITION AND METHOD OF PACKAGING USING THE SAME.

摘要

A solder depositing composition containing a powdery Sn-Pb alloy and a lead salt of an organic acid as the essential components and depositing solder by the displacement reaction between the Sn atom of the alloy and the Pb ion of the organic acid salt. The packaging method comprises the steps of supplying the solder depositing composition to a conductive part formed on a substrate; forming a solder precoat on the conductive part by heating the supplied composition to deposit solder by the displacement reaction between the Sn atom and the Pb ion, mounting elements on the solder precoat thus formed, and packaging the elements on the conductive part by melting the precoat.