发明名称 Low heat release polymeric composites.
摘要 <p>A low heat release, low density, fiber-reinforced composite comprises a matrix comprising a thermoplastic polymer selected from polyarylsulfone, polyethersulfone, polyetheretherketone, polyetherketoneketone, a copolycarbonate of 4,4'-thiodiphenol and at least one of bisphenol A, 9,9-bis(4-hydroxyphenyl) fluorene, and 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane, a copolycarbonate of bisphenol A and 9,9-bis(4-hydroxyphenyl) fluorene, 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane polycarbonate, bisphenol A polycarbonate, and polyetherimide, and having from 10 to 70 percent by weight of the composite of randomly oriented reinforcing fibers, less than 12.75 mm (0.5 inch) in length, distributed throughout the matrix. The matrix has a void volume of from 20 to 90 percent by volume and the composite has a thermoplastic skin layer on each of the major surfaces thereof.</p>
申请公布号 EP0683037(A1) 申请公布日期 1995.11.22
申请号 EP19950303242 申请日期 1995.05.15
申请人 THE DOW CHEMICAL COMPANY 发明人 MARTIN, PATRICK H.;KIM, PETER K.;BALES, STEPHEN E.;WESSLING, RITCHIE A.
分类号 B32B27/08;C08K7/02;(IPC1-7):B32B5/18;B32B5/02;B29C44/00 主分类号 B32B27/08
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