| 发明名称 |
Method of making a high-definition printed circuit |
| 摘要 |
A method of making printed circuit boards in a continuous process. The method uses copper base metal sputtered onto a substrate. This base metal is much thinner than the base metal normally used in printed circuit processes and ultimately allows a greater number of conductors per unit of length to be made on the boards.
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| 申请公布号 |
US5468345(A) |
申请公布日期 |
1995.11.21 |
| 申请号 |
US19940237835 |
申请日期 |
1994.05.04 |
| 申请人 |
KIRBY, RONALD K.;WATSON, JAMES W. |
发明人 |
KIRBY, RONALD K.;WATSON, JAMES W. |
| 分类号 |
H05K1/00;H05K3/00;H05K3/06;H05K3/10;H05K3/38;(IPC1-7):B44C1/22;C23F1/02 |
主分类号 |
H05K1/00 |
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代理人 |
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