| 摘要 |
PURPOSE: To provide a ball grid array package difficult to peel off. CONSTITUTION: Formed on a printed circuit board 11. A die depositing Cu layer is 12 on which an epoxy solder resist with polyimide or strong bond material 13 of adhesive tape is provided on the layer 12. To couple an epoxy adhesive 15 with the Cu layer 12, through-holes 14 are formed. On the bond material 13 the epoxy adhesive 15 is applied to adhere a chip 16 to the adhesive 15. Around the chip on the circuit board 11 a package 17 is formed. Between the adhesive 15 and Cu layer 12 the bond material 13 is provided to absorb the heat stress due to a thermal mismatching to avoid peel-off due to the thermal deformation, thereby surely increasing the adhesion between the adhesive 15 and Cu layer 12. |
