| 摘要 |
PURPOSE:To enhance the signal characteristics and the heat dissipation by a method wherein a metallic layer is provided on the whole respective lead pins leaving the ends of numerous lead pins through the intermediary of an insulating layer. CONSTITUTION:Within the lead frame made of a base material comprising a metallic flat plate, etc., an island 3 in a square shape is formed in the central part moreover, multiple comblike lead pins 4, 4 are formed around the island 3. On the other hand, a larger area metallic layer i.e., a grounding layer 6 is arranged through the intermediary of an insulating layer 5 on the whole respective lead pins 4, 4 leaving the ends of multiple leads 4, 4 intact. Accordingly, respective lead pins 4, 4 become the micro strip line. Thus, the power supply bounce noise can be abated by extending the grounding layer 6. Furthermore, due to respective lead pins 4, 4 serving as the microstrip line, any other lines even a high frequency signal can be transmitted without being affected thereby. |
