| 摘要 |
PURPOSE:To avoid the malfunction of an LSI by placing parallel flat plate type bypass capacitors in a cavity and placing integrated circuits directly just above the capacitors or above through support members. CONSTITUTION:A 3-stage structured cavity 13 is formed in a central part of a package 10 in which ground layers 34 and power source layers 35 are formed such that a part of the layer 35 is exposed on the surface of a bottom part 3a of the cavity 13 and part of the layer 34 is also exposed on a face 13b above by one stage from the bottom 13a of the cavity 13. To the bottom 13a of the cavity 13, parallel flat plate type capacitors 11 are entirely adhered through a conductive material 12 serving as an adhesive agent, and just above the capacitor 11 an LSI chip 33 is adhered similarly through the material 13. Thus, a bypass capacitor-mounted multilayer package difficult to cause a malfunction is obtained. |
