发明名称 SUBSTRATE HOLDING CHUCK, SUBSTRATE HOLDING UNIT AND SUBSTRATE TREATING DEVICE
摘要 <p>PURPOSE:To make a substrate treating tank small and at the same time, to suppress the generation of particles. CONSTITUTION:A substrate treating device is a device for treating a wafer W with the vertically arranged main surface using a treating liquid and is provided with a substrate treating part 5 and third substrate transfer robots. The part 5 has a substrate treating tank 55 provided with holding members 57 and 59, which are provided on vertical walls 56 and slant surfaces 58 and support the side surfaces of the wafer W. The robots are arranged at prescribed intervals in the arrangement direction to intersect the main surface of the wafer W and have a substrate suction arm 48 which is extended in the longitudinal direction. Suction holes 49 for sucking the rear of the wafer W are formed on both surfaces of the arm 48.</p>
申请公布号 JPH07307374(A) 申请公布日期 1995.11.21
申请号 JP19940096764 申请日期 1994.05.10
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 ARAKI HIROYUKI;MURAOKA YUSUKE
分类号 B65G49/07;H01L21/304;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/07
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