| 摘要 |
PURPOSE: To provide a high density LED array having semiconductor interconnections. CONSTITUTION: The LED array comprises material layers laminated on a substrate 15', including a conductive layer 16', first carrier sealed layer 17', active layer 18' and second carrier sealed layer 19'. These layers are separated into discrete LEDs 25', 30' in a matrix of rows and columns. The conductive layer connects first electrodes of the LEDs on columns to those of other LEDs on columns. Row conductors 35' connect second electrodes of the LEDs on rows to those of other LEDs on rows. Column conductors are connected to the conductive layer on the columns. |
