发明名称 MICROENCAPSULATED CURING AGENT, PRODUCTION THEREOF, THERMOSETTING RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL
摘要 PURPOSE:To obtain the agent which has good room-temperature storage stability and can provide a thermosetting resin composition and a prepreg excellent in heat resistance after being cured by coating a curing agent with a specified resin. CONSTITUTION:This agent essentially consists of a curing agent (A) for a thermosetting resin and a thermoplastic resin (B) soluble in the thermosetting resin when heated, is in the form of particles each of which is composed of component A, and a layer mainly made from component B and coating component A and has an average particle diameter of 0.1-20mum. It is desirable that both of components A and B are insoluble in water and soluble in a hydrophobic organic solvent having a boiling point of 100 deg.C or below. Particularly desirable examples of component A include an aromatic amide, an imidazole compound and an imidazole compound/ glycidyl compound adduct. This agent is obtained by dissolving components A and B in an organic solvent, emulsifying the solution in water, and removing the organic solvent from the emulsion.
申请公布号 JPH07304968(A) 申请公布日期 1995.11.21
申请号 JP19950045470 申请日期 1995.03.06
申请人 TORAY IND INC 发明人 SAWAOKA RYUJI;KAWACHI SHINJI;MURAKI TOSHIO
分类号 B29B11/16;B01J13/12;C08G59/18;C08G59/50;C08G73/00;C08J5/24;C08L101/00;(IPC1-7):C08L101/00 主分类号 B29B11/16
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