| 摘要 |
PURPOSE:To enhance the parallelism of both faces of a cut wafer and easily remove a wire out of a cut groove of the cut work by a method wherein cutting liquid containing abrasive grains is supplied to the center of the cut groove of the work together with the wire for effectively cutting the work and thereafter discharged from the cut groove immediately after cutting. CONSTITUTION:A wire saw device comprises a wire 2 running in a vertical direction, a work travel device 30 for traveling a work 45a loaded on a surface opposed to the wire 2 toward the wire 2, and a cutting liquid supply part 35 for supplying cutting liquid 35a to a part of the work 45a to be cut by the wire 2. |
