| 摘要 |
PURPOSE:To prevent the bonding of a resin-impregnated base layer from being impeded by copper ions contained in a circuit by a method wherein an adhesion reinforcing layer, a resin-impregnated base layer, and a board foil layer are successively laminated, at least, on the one side of a board equipped with an inner circuit of copper. CONSTITUTION:A board 1 previously subjected to a plating process is introduced into a continuously laminating device, a glass cloth impregnated with unsaturated polyester resin 3 and a copper foil 9 are continuously laminated in this sequence on both sides of the board 1 by pairs of rolls 10 and 14 into a laminate 8 of integral structure. Then, the laminate 8 is subjected to a primary heating process to cure the unsaturated polyester resin 5. The bonding of impregnating resin is not impeded by copper ions contained in a circuit. Therefore, a resin- impregnated base layer is hardly blistered by heat released in a component mounting process and prevented from being separated off. |
