| 摘要 |
PURPOSE:To provide a low-cost small inspecting jig board, having high contact reliability, which can be used when inspecting the electric characteristics of a semiconductor package (BGA package and the like) having protruding external connection section. CONSTITUTION:A semi-spherical recessed part 14 is formed on a metal plate 11 by press forming using a metal base board having a circuit-processed copper foil layer 13 through an insulating layer 12. The recessed part 14 is provided on the position opposing to the external connection section of a semiconductor package. One end of the circuit-processed copper foil layer 13 is exposed to a wiring pattern, and the other end is used as the connection pad part 15 for connection with an external part. The recessed part 14 and the external connection section of the package 15 are coincided and brought in contact with each other, and their electrical contact is obtained accurately. |
