| 摘要 |
PURPOSE:To provide an X-ray inspection device of a structure, wherein bent, deformation or the like of bonding wires and inner leads in semiconductor devices subsequent to molding is automatically inspected. CONSTITUTION:Semiconductor devices with their lead frames prior to cutting are transferred from a loader 3 to an X-ray inspection part 2a by a frame transfer part 7, the devices 1 are positioned by frame positioning guides 6 and 6a, X-rays are applied to the devices 1 from an X-ray irradiation device, images within the devices 1 from an X-ray taken in a main processor 11 by an imaging means and a defect, such as the deformation or bent of bonding wires and inner leads, is inspected by a control part 12. In the case where there is the defect in one of the devices 1, the device 1 is transferred on a defective exclusive receiving pan 5 and in the case where there is no defect in the devices 1, the devices 1 are transferred and housed in an unloader 4 by the frame transfer part 7. These operations are repeated and all of the operations are automatically executed until the devices 1 to be inspected are eliminated on the loader 3. |
