| 摘要 |
<p>PURPOSE:To support reliably thin plates, such as semiconductor wafers, by a small power to protect the thin plates from a vibration and a shock by a method wherein a thin plate pressure member is constituted by arranging a multitude of pressure strips, which respectively make contact with the peripheral edge part of each thin plate and support the thin plates one by one, in parallel and each pressure strip is molded using a waveform elastic plate material. CONSTITUTION:A pressure part 22 is constituted by arranging a multitude of pressure strips 23, which respectively make contact with the peripheral edge part of each semiconductor wafer and support the wafers one by one, in parallel and the strips 23 are molded using a waveform elastic plate material. Each pressure strip 23 makes contact with the upper side peripheral edge part of each wafer and supports reliably this semiconductor wafer by a small power. Moreover, as a stress does never locally concentrate on the waveform press strips 23 and the attenuation of the springs of the strips 23 is little even if the strips 23 are used for a long period, the wafers can be reliably supported by the strips.</p> |
