| 摘要 |
PURPOSE:To surely prevent failures of conductive paste printing in a through- hole printing process. CONSTITUTION:A pasting process wherein an adhesive film 2 is pasted on the surface S1 of a green sheet 1 and a hole boring process wherein a through- hole forming hole 3 is bored in the green sheet 1 are provided. A resin film 6 is bonded to the rear S2 of the green sheet 1 subjected to a hole boring process. A through-hole printing process is carried out with tungsten paste 8. Then, the film 6 is separated from the green sheet 1. Thereafter, a pattern printing process, a separating process through which the adhesive film 2 is separated from the green sheet 1, a green sheet laminating process, and a burning process are carried out. |
