| 摘要 |
PURPOSE:To obtain a thermosetting resin compsn. which can form an insulating layer having excellent adhesion to a conductor layer and excellent heat resistance by incorporating a slow-reacting epoxy resin and a filler decomposable or dissolvable with a roughening agent. CONSTITUTION:A thermosetting resin compsn. comprising (A) an epoxy resin, (B) a curing agent for the epoxy resin, (C) a filler decomposable or dissolvable with a roughening agent, and (D) an org. solvent as essential components, component (A) contg. not less than 30 pts.wt. slow-reacting epoxy resin having a gelation time of 9min or above, measured by a specific test method, based on 100 pts.wt. component (A). A process for preparing a multilayer printed wiring board by successively forming a resin insulating layer and a conductor layer of a specific circuit pattern on a conductor layer of a wiring board with a circuit formed thereon comprises forming a resin insulating layer of the resin compsn. by coating, heating the coating to a semi-cured state, treating the surface of the insulating layer with a roughening agent to form a roughened surface having irregularities, forming a conductor layer on the irregular surface, and conducting heat treatment again to cure the insulating layer. |
