发明名称 |
Lead frame having dummy leads |
摘要 |
A lead frame for a semiconductor device used in a vertically surface-mounted package which has internal leads gathered on one side thereof includes separately formed dummy leads attached to a semiconductor chip on the opposite side of the lead frame to avoid an inconsistent inflow pressure of a molding material during a package molding process caused by gathering of the internal leads on only one side, thereby enhancing reliability of the semiconductor package. There is also no need to separately form a heat sink structure for eliminating heat of the semiconductor chip since the dummy leads function as the heat sink. |
申请公布号 |
US5468991(A) |
申请公布日期 |
1995.11.21 |
申请号 |
US19930158740 |
申请日期 |
1993.11.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JOON K.;JEONG, HYEON J. |
分类号 |
H01L21/56;H01L23/28;H01L23/495;H01L23/50;(IPC1-7):H01L23/48;H01L29/43;H01L29/54 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|