发明名称 MOLDING METHOD FOR RESIN SPECIMEN PLATE FOR OPTICAL MEASUREMENT AND MOLDING DIE THEREFOR
摘要 PURPOSE:To obtain a molding die of a novel structure capable of producing a large number of resin specimen plates with a high yield in a stable, simple, and rapid manner even if the molding die is small in number and a method for simply forming a resin specimen plate using the molding die. CONSTITUTION:A molding die is a die for molding a resin specimen plate 32 for an optical measurement of fixed thickness and area out of resin powder while melting and pressurizing the resin powder. An inner space is formed by a bottom surface member 11, a hollow member 1 forming a side wall opened in the upper part thereof and having a flat upper surface, and an upper surface member 12 for covering the upper opening and matching to the flat surface of the member 1 at the lower surface thereof. A recessed part 9 is formed around the upper opening of the flat surface of the member 1 forming the side wall. Resin powder 30 of a quantity larger than the capacity of the inner space is charged in the inner space to the brim to be molded under heat and pressure into the resin specimen plate. A remaining melt resin flows into the recessed part 9. The resin specimen plate fitted in the member 1 is used as it is for an optical measurement.
申请公布号 JPH07304051(A) 申请公布日期 1995.11.21
申请号 JP19940096128 申请日期 1994.05.10
申请人 SHIN ETSU CHEM CO LTD;NIKKISO CO LTD 发明人 TAKEUCHI MASARU;KAMINAGA KENZO;YOSHIKOSHI HIDEO;SUZUKI MASAAKI;TSUTSUMI ATSUSHI;KATO KEISUKE;KAWAMURA AKIO;NOGAMI YUJI;CHINO TAKASHI
分类号 B29C43/36;B29C43/02;B29K27/06;B29L31/40;(IPC1-7):B29C43/02 主分类号 B29C43/36
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