| 摘要 |
PURPOSE:To provide a lead frame having excellent electric characteristics. CONSTITUTION:A lead frame 1 is composed of plural lead pins 2 juxtaposed at a specific interval at this time, the lead pins 2 provided with inner lead part to chip terminal as shown in the figure (a) but IC is not shown, on the other hand, plural lead pins comprising inner lead part connecting to outer lead part and outer lead part connecting to outer circuit are provided. Within respective lead pins 2, insulating layers 4 are provided between metallic wires 3a and 3b as shown in the figure (a) while conductive layers 5 are formed on the whole surface including the two metallic wires 3a, 3b and the insulating layers 4. In such a constitution, the characteristic impedance can be specified by selecting either the intervals between metallic wires 3a, 3b in respective lead pins 2 or the intervals of the insulating layers 4 thereby enabling the characteristics impedance of an IC chip or outer circuit to be matched. |
