发明名称 |
DRAM CELL MANUFACTURING PROCESS |
摘要 |
The method for manufacturing a capacitor for a semiconductor memory device comprises the steps of: depositing a first insulating layer over a conductive layer with a prominence and depression surface and etching back to leave the first insulating layer only at a part of the conductive layer; anisotropic-etching the conductive layer by using the first insulating layer as a mask and forming a second prominence and depression thereover; depositing a second insulating layer over the conductive layer; etching back the second insulating layer to leave the second insulating layer only at a part of the conductive layer; and etching the conductive layer by using the remaining second insulating layer as a mask and forming a third prominence and depression thereover.
|
申请公布号 |
KR950013904(B1) |
申请公布日期 |
1995.11.17 |
申请号 |
KR19920002129 |
申请日期 |
1992.02.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIM, SANG - PIL |
分类号 |
H01L27/04;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|